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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad 3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-k. The material offers exceptional thermal performance at low pressures due to an all-new 3 W/m-k filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Use Gap Pad 3000S30 for high performance, low-stress applications that typically use fixed standoff or clip mounting.
For more information, please visit this product's webpage.
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Gap Pad is a registered trademark of The Bergquist Company®
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