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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad A3000 is a thermally conductive, filled-polymer laminate, supplied on a reinforcing mesh for added electrical isolation, easy material handling and enhanced puncture, shear and tear resistance. Gap Pad A3000 has a reinforcement layer on the dark gold side of the material that assists in burn-in and rework processes while the light gold and soft side of the material allows for added compliance.
For more information, please visit this product's webpage.
Currently viewing: Gap Pad A3000 - Gap Pad A3000 0.100" - GPA3000-0.100-02-0816-NA
Gap Pad is a registered trademark of The Bergquist Company®
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