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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad A2000 acts as a thermal interface and electrical insulator between electrical components and heat sinks. In the thickness range of 10 to 40 mil, Gap Pad A2000 is supplied with natural tack on both sides, allowing for excellent compliance to the adjacent surfaces of components. The 40 mil material thickness is supplied with lower tack on one side, allowing for burn-in processes and easy rework.
For more information, please visit this product's webpage.
Currently viewing: Gap Pad A2000 - Gap Pad A2000 0.010" - GPA2000-0.010-02-0816-NA
Gap Pad is a registered trademark of The Bergquist Company®
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