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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad 1500 has an ideal filler blend that gives it a low modulus characteristic that maintains optimal thermal performance yet still allows for easy handling. The natural tack on both sides of the material allows for good compliance to adjacent surfaces of components, minimizing interfacial resistance.
For more information, please visit this product's webpage.
Currently viewing: Gap Pad 1500 - Gap Pad 1500 0.080" - GP1500-0.080-02-0816-NA
Gap Pad is a registered trademark of The Bergquist Company®
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