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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad VO Soft is recommended for applications that require a minimum amount of pressure on components. Gap Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. Use Gap Pad VO Soft as an interface where one side is in contact with a leaded device.
For more information, please visit this product's webpage.
Currently viewing: Gap Pad VO Soft - Gap Pad VO Soft 0.100" /AC - GPVOS-0.100-AC-0816-NA
Gap Pad is a registered trademark of The Bergquist Company®
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