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Gap Pad is a thermally conductive material that acts as a thermal interface between a heat sink and an electronic device. The comfortable nature of Gap Pad allows the pad to fill-in air gaps between PC boards and heat sinks or a metal chassis. Gap Pad is also available with or without adhesive.
Gap Pad VO is a cost effective thermally conductive interface. The material is a filled thermally conductive polymer supplied on a rubber coated fiberglass carrier allowing for easy material handling. The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.
For more information, please visit this product's webpage.
Currently viewing: Gap Pad VO - Gap Pad VO 0.040" /AC - GPVO-0.040-AC-0816-NA
Gap Pad is a registered trademark of The Bergquist Company®
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